·Paper Publications
Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex (UTCOF) assembly
Release time:2018-02-02 Hits:
Co-author: Jian-Kui Chen, Zhou-Long Xu, Yong-An Huang,Zhou-ping Yin
Journal: Science China Technological Sciences
Included Journals: SCI
Discipline: Engineering
First-Level Discipline: Mechanical Engineering
Document Type: J