·Paper Publications
Reliable thin chip peeling from adhesive tape with inverted needle ejecting and spring buffering
Release time:2018-02-02 Hits:
Indexed by: Journal paper
Correspondence Author: Jian-Kui Chen
Co-author: in-Hua Hong, Jian-Kui Chen, Zhou-Long Xu, Zhou-Ping Yin
Journal: Journal of Adhesion Science and Technology
Included Journals: SCI
Document Type: J