陈建魁

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Competing Fracture of Thin-Chip Transferring from/onto Prestrained Compliant Substrate
Release time:2018-02-02  Hits:

Correspondence Author: Jian-Kui Chen

Co-author: Hui-Min Liu, Zun-Xu Liu, Zhou-Long Xu, Zhou-Ping Yin, Yong-An Huang, Jian-Kui Chen

Journal: Journal of Applied Mechanics

Included Journals: SCI

Discipline: Engineering

First-Level Discipline: Mechanical Engineering

Document Type: J