陈建魁
189
2025-5-20，Tuesday
·Paper Publications
High-efficiency Revolving-turret Chip Transferring Technology for Flip Chip Packaging
Release time:2018-02-02 Hits:
Co-author: Jin-Hua Hong, Jian-Kui Chen, Zhou-Long Xu, Zhou-Ping Yin
Journal: IEEE Transactions on Components, Packaging and Manufacturing Technology
Included Journals: SCI
Document Type: J