·Paper Publications
An SiC-Based Half-Bridge Module With an Improved Hybrid Packaging Method for High Power Density Applications
Release time:2018-01-17 Hits:
Indexed by: Journal paper
First Author: C. Chen
Correspondence Author: Y. Chen
Co-author: Y. Li,Z. Huang,T. Liu,Y. Kang
Journal: IEEE Trans. Ind. Electron.
Included Journals: SCI
Discipline: Engineering
Volume: 64
Issue: 11
Page Number: 8980-8991
Date of Publication: 2017-07-05