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First Author:
J Bian, F Chen, H Ling, N Sun, J Hu, YA Huang
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Correspondence Author:
YongAn Huang
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Co-author:
Furong Chen,Hong Ling,Ningning Sun,Jinlong Hu
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Journal:
International Journal of Heat and Mass Transfer
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Included Journals:
SCI
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Affiliation of Author(s):
State Key Laboratory of Digital Manufacturing Equipment and Technology
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Funded by:
This study was supported by the National Natural Science Foundation of China (52105576, 51635007), t
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Volume:
188
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Page Number:
122609
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Key Words:
Flexible electronicsInterface adhesionLaser lift-offLaser ablationBulk photothermal model
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DOI number:
10.1016/j.ijheatmasstransfer.2022.122609
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Date of Publication:
2022-06-01
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Links to published journals: