Huang YongAn

Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Conformal Peeling of Device-on-Substrate System in Flexible Electronic Assembly

Release time:2020-07-15Hits:

Indexed by:

Journal paper
First Author:

YongAn Huang
Correspondence Author:

YongAn Huang
Co-author:

YongAn Huang , Huimin Liu, Zhoulong Xu , Jiankui Chen ,Zhouping Yin
Journal:

IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
Affiliation of Author(s):

the School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuh
Document Type:

J
Key Words:

Energy release rate (ERR), ﬂexible electronics, interfacial peeling, roll to roll
Date of Publication:

2018-02-15