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Indexed by:
Journal paper
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First Author:
Fuquan Jina
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Correspondence Author:
Wenlong Li
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Co-author:
Sheng Fenga, Yong-an Huanga, Wenlong Li
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Journal:
Seventh International Conference on Optical and Photonic Engineering
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Document Type:
C
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Volume:
11205
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Key Words:
Flexible-electronics, complex surface measuring, 3D matching
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Date of Publication:
2019-10-16
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Abstract:
Flexible-electronics is gaining increasing popularity in microelectronics such as flexible display, smart skin, epidermal electronics and soft robotics due to cost-effective fabrication and possibility of obtaining multifunctional electronics over large areas. Distinct from conventional microelectronics, flexible curved substrate such as polyimide has been adopted in the flexible-electronics manufacturing process. Hence, how to measure the curved surfaces of the substrates in a precise and fast way has become a key issue. Traditionally, the curved surfaces are usually measured in a coordinate
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Links to published journals:
