Huang YongAn

Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

On the analysis of dynamic effect in the die pick-up process

Release time:2018-03-05Hits:

Indexed by:

Essay collection
First Author:

Bo Peng
Co-author:

YongAn Huang, ZhouPing Yin, YouLun Xiong
Journal:

Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on
Page Number:

1-4
Key Words:

Needles, Stress, Substrates, Integrated circuits, Finite element methods, Electronics packaging
Date of Publication:

2011-08-08