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Scientific Research
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Huang YongAn
Professor
Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Professional Title:
Professor
Gender:
Male
Status:
Employed
Department:
智能制造装备与技术全国重点实验室
Education Level:
Postgraduate (Doctoral)
Degree:
Doctoral Degree in Engineering
Alma Mater:
Northwestern Polytechnical University
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Paper Publications
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Paper Publications
Analysis of interfacial peeling in IC chip pick-up process
Release time:2018-03-05
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Journal paper
First Author:
Peng Bo
Co-author:
Peng Bo; Huang YongAn ; Yin ZhouPing ; Xiong YouLun
Journal:
Journal of Applied Physics
Discipline:
Engineering
Volume:
110
Issue:
7
Page Number:
1-7
Date of Publication:
2011-10-01
Attachments:
Journal of Applied Physics,2011.pdf
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Automatic registration for 3D shapes using hybrid dimensionality-reduction shape descriptions
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Roll-to-Roll Processing of Flexible Heterogeneous Electronics with Low Interfacial Residual Stress