中文

Huang YongAn

Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Professional Title:Professor
Gender:Male
Status:Employed
Department:智能制造装备与技术全国重点实验室
Education Level:Postgraduate (Doctoral)
Degree:Doctoral Degree in Engineering
Alma Mater:Northwestern Polytechnical University

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Paper Publications iFLEX@HUST >> Scientific Research >> Paper Publications

Competing Fracture Modeling of Thin Chip Pick-Up Process

Release time:2018-03-05Hits:

Indexed by:

Journal paper
First Author:

Peng Bo
Co-author:

Peng Bo; Huang YongAn ; Yin Zhouping ; Xiong Youlun
Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology
Discipline:

Engineering
Volume:

2
Issue:

7
Page Number:

1217 - 1225
Key Words:

Substrates, Stress, Indexes, Needles, Silicon, Assembly, Force
Date of Publication:

2012-06-13

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