Huang YongAn

Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex (UTCOF) assembly

Release time:2018-03-06Hits:

Indexed by:

Journal paper
First Author:

Chen, JianKui
Co-author:

JianKui; Xu, ZhouLong ;Huang YongAn ; Duan, YongQing; Yin, (*) Huang, YongAn ZhouPing
Journal:

Science China Technological Sciences
Volume:

59
Issue:

11
Page Number:

1646-1655
Date of Publication:

2016-11-01