Huang YongAn

Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Modeling and Application of Flexible Electronics Packaging

Release time:2020-04-27Hits:

Faculty/School:

Huazhong University of Science and Technology
Publisher:

Springer Nature & 科学出版社
Place of Publication:

Singapore
The First Author:

黄永安,尹周平,万晓东
Type of Works:

Monograph
Publication Design:

Foreign (overseas) publishing house
Classification of Disciplines:

Engineering
First-Level Discipline:

Mechanical Engineering
ISBN No.:

978-981-13-3626-3
Date of Publication:

2019-01-01
Translated or Not:

no
Description of Publication:

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.