·Patents
一种非接触式一维纳米材料阵列的大面积组装方法
Release time:2018-03-20 Hits:
Affilication of Author(s): 华中科技大学
Patent Applicant: 胡彬,周军,方云生,吴智聪
Type of Patent: Invent
Authorization number: ZL201510182642.2
Authorization Date: 2017-01-11
Affilication of Author(s): 华中科技大学
Patent Applicant: 胡彬,周军,方云生,吴智聪
Type of Patent: Invent
Authorization number: ZL201510182642.2
Authorization Date: 2017-01-11