·Paper Publications
[24] C. J. Peng, L. Wang, Q. W. Li, Y. Y. Li, P. K. Chu, K. F. Huo*, “Ge@CNFs Anchored on 3D Graphene Foam for Binder-free and High-Efficiency Anodes in Li-Ion Batteries”, ChemElectroChem 2017,4, 1002 – 1006.
Release time:2019-10-11 Hits:
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Dan Xie, Honghai Zhang, Sheng Liu, Fulong Zhu, Sheng Tao, “Mechanical Properties Investigation of PMMA PC and PS during Thermal Nanoimprinting”, 2008 4th International Symposium on Precision Mechanical Measurements, v7130, 2008. (EI,DOI: 10.1117/12.819561)
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Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Microstructures and Tensile Properties of a Sn-Cu Lead-free Solder Alloy”, Journal of Materials Science: Materials in Electronics, v17, n5, p379-384, 2006.( SCI, EI, DOI: 10.1007/s10854-006-7474-3)