·Patents
一种用于零重力环境模拟的近零刚度支承装置
Release time:2024-06-10 Hits:
Scope of patent: 中国
School Sign: 华中科技大学
Disigner of the Invention: 周一帆,周睿,姜伟,吴九林,罗鑫皓
Type of Patent: Invent
Application Number: CN202111350490.4
Authorization number: CN113942666B
Number of Inventors: 6
Application Date: 2021-11-15
Publication Date: 2022-01-18
Authorization Date: 2023-10-20
First Author: 陈学东