电子器件热管理
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随着电子器件的微型化，热点的热流密度甚至接近太阳表面。电子器件的负荷变化也将导致热点的发热功率密度随时间动态改变。项目组专注开发集成半导体热电制冷与微流道混合冷却的传热理论、设计方法与表征平台，实现电子器件热点局部高热流的动态热管理。
Dynamic Thermal Management of Electronic Devices
With the miniaturization of electronic devices, the heat flux density of hotspots can approach that of the sun’s surface. Variations in device workload also cause the power density of hotspot heat generation to change dynamically over time. The research team focuses on developing heat transfer theories, design methods, and characterization platforms that integrate semiconductor thermoelectric cooling with microchannel hybrid cooling, aiming to achieve dynamic thermal management of localized high heat flux in electronic device hotspots.