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超高热流密度芯片温度控制的热电薄膜瞬态制冷技术研究
Release time:2025-04-29 Hits:
Supported by: 深圳市科技创新委员会
Sub-Class of Project: Key Program
Supported by: 深圳市科技计划项目
Project level: Prefectural
Date of Project Completion: 2024-07-31
Date of Project Initiation: 2021-08-01
Subsidy Amount: 70.0