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Understanding interfacial compounds induced by Ag diffusion on improving interface electrical contact resistivity between the Cu electrode and Bi2Te3 thin film
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第一作者：Zeyu,Liu,Dongfang,Sun
通讯作者：Zhichun,Limei Liu,Limei,Shen
合写作者：Zun,Junhao Liu,Yan,Qiufeng,Jianming Yao,Xiangnong Ye,Jingyu Liu,Cai Niu,Haoqing Gao,Xue Wang,Han
发表刊物：Journal of Alloys and Compounds
卷号：1001
页面范围：175101
ISSN号：1873-4669
DOI码：10.1016/j.jallcom.2024.175101
发表时间：2024-01-01