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科技创新2030—重大项目子课题:感存算一体化的多维融合光电智能感知芯片,150万,SQ2021AAA010105,2022年1月至2025年12月,主持
Release time:2024-04-18  Hits:
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高逼真模拟神经递质动力学过程的神经形态器件研究
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国家重点研发计划课题:RRAM三维堆叠集成技术研究,1494万元,2023YFB4402402,2023.11-2027.12,主持