·Paper Publications
Chen, Guang; Huang, Bomin; Liu, Hui; Chan, Y.C.; Tang, Zirong; Wu, Fengshun. An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder. Soldering and Surface Mount Technology, v 28, n 2, p 84-92, 2016
Release time:2018-07-01 Hits:
Included Journals: SCI
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Pre One:：
Chen, Guang ; Liu, Li; Silberschmidt, Vadim V.; Liu, Changqing; Wu, Fengshun; Chan, Y.C.. Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient. Journal of Materials Science: Materials in Electronics, v 29, n 7, p 5253-5263, April 1, 2018
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Next One:：
Peng, Hao; Chen, Guang; Mo, Liping; Chan, Y.C.; Wu, Fengshun; Liu, Hui. An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3.0Ag0.5Cu composite solder joints. Journal of Materials Science: Materials in Electronics, v 27, n 9, p 9083-9093, September 1, 2016