Weisheng Xia
·Enrollment Information
Current position:
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Enrollment Information
Release time:2019-05-02 Hits:
Test Subjects: 电子制造技术基础、微连接原理
Department: 材料科学与工程学院
Specialized Courses: 电子封装
Master-Research direction: 先进电子制造装备、先进连接工艺
Year of Admission: 2020
Admission Type: Master Degree Candidate
Expected Number of Students to Be Admitted: 3