Weisheng Xia
·Enrollment Information
Current position:
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Enrollment Information
Release time:2019-05-02 Hits:
Test Subjects: 材料科学基础
Department: 材料科学与工程学院
Specialized Courses: 电子封装
Master-Research direction: 先进封装技术、电子工艺与装备技术
Year of Admission: 2027
Admission Type: Master Degree Candidate
Discipline: Material Science and Engineering
Expected Number of Students to Be Admitted: 3