·Paper Publications
Fulong Zhu*, Zhiyong Wang, Rongfeng Guan, Honghai Zhang, Sheng Liu, “Mechanical properties investigation of a SnAg solder”, Proceedings of 2005 International conference on electronics packaging, Tokyo，Japan，April 13-15, 2005, pp.208-213.(ISTP)
Release time:2018-09-19 Hits:
Included Journals: EI
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Pre One:：
Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Temperature and Strain Rate Behavior of Lead-free Solder Sn96.5Ag3.5”, 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2006), p 239-243, 2006.( EI, DOI: 10.1109/IPFA.2006.251038)
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Next One:：
Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Creep Behaviors of a Lead-free Solder Alloy Sn96.5Ag3.5”, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, p1-6, 2006. ( EI, DOI: 10.1109/ICEPT.2006.359866)