·Paper Publications
ZHU Fu-long*, WANG Zhi-yong, GUAN Rong-feng, WANG Xue-fang, ZHANG Hong-hai, LIU Sheng, “Single Axis Mini-Tester of Mechanical Property for Micro-Specimen”, The 3rd International Symposium on Instrumentation Science and Technology (ISIST2004), Aug.18-22, 2004, Xi’an, China, Vol.3, 0562-0568.（ISTP）
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Fulong Zhu*, Zhiyong Wang, Rongfeng Guan, Honghai Zhang, “Mechanical Properties of a Lead-Free Solder Alloys”, 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC, v 2005, p107-112, 2005.( EI, DOI: 10.1109/AGEC.2005.1452326)
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Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Temperature and Strain Rate Behavior of Lead-free Solder Sn96.5Ag3.5”, 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2006), p 239-243, 2006.( EI, DOI: 10.1109/IPFA.2006.251038)