·Paper Publications
Dan Xie, Honghai Zhang, Sheng Liu, Fulong Zhu, Sheng Tao, “Mechanical Properties Investigation of PMMA PC and PS during Thermal Nanoimprinting”, 2008 4th International Symposium on Precision Mechanical Measurements, v7130, 2008. (EI,DOI: 10.1117/12.819561)
Release time:2018-09-19 Hits:
Included Journals: EI
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Pre One:：
Zhaohui Chen, Shengjun Zhou, Zhicheng Lv, Chuan Liu, Xing Chen, Xiao Jia, Ke Zeng, Bin Song, Fulong Zhu, Mingxiang Chen, Xuefang Wang, Honghai Zhang, Sheng Liu, “Expert advisor for integrated virtual manufacturing and reliability for TSV/SiP based modules”, 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011, p1183-1189, 2011. (EI, DOI: 10.1109/ECTC.2011.5898660)
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Next One:：
Fulong Zhu*, Shao Song, Wei Zhang, Sheng Liu, “Creep behavior investigation of lead-free solder alloy Sn96.5Ag3Cu0.5”， 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, p195-198, 2010.(EI, DOI: 10.1109/ICEPT.2010.5582445)