·Paper Publications
Hengyou Liao, Fulong Zhu*, Wei Zhang, Chen Youkai; Song Shao; Liu Sheng, “Tensile behaviors investigation of SWCNT-Ni with vacancies”，2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP2012, p294-297, 2012. (EI, DOI:10.1109/ICEPT-HDP. 2012.6474621)
Release time:2018-09-19 Hits:
Included Journals: EI
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Pre One:：
Hengyou Liao, Fulong Zhu*, Sheng Liu, “Mechanical stretching behavior simulation of SWCNT and SWCNT-Ni”, 2011 International Symposium on Advanced Packaging Materials, APM 2011, p85-90, 2011. (EI, DOI: 10.1109/ISAPM.2011.6105677)
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Next One:：
Hengyou Liao, Fulong Zhu*, Wei Zhang, Chen Youkai; Song Shao; Liu Sheng, “Torsion behavior simulation of Ni-coating SWCNT based on molecular dynamics”. 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, p1155-1158, 2012. (EI, DOI: 10.1109/ICEPT-HDP.2012.6474812)