·Paper Publications
Youkai Chen, Fulong Zhu*, Kai Tang, Ying Li, Hengyou Liao, Xiahui Chen, Sheng Liu, “Mechanical Properties Investigation of Graphene Coated with Ni”， the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, p756-759,2013.( EI, DOI: 10.1109/EPTC.2013.6745822)
Release time:2018-09-19 Hits:
Included Journals: EI
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Pre One:：
Youkai Chen, Fulong Zhu, Kai Tang, Ying Li, Hengyou Liao, Sheng Liu, “Mechanical behavior investigation of single-walled carbon nanotubes with one vacancy”, 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p579-582, 2013. (EI, DOI: 10.1109/ICEPT. 2013.6756537)
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Next One:：
Hengyou Liao, Fulong Zhu*, Sheng Liu, “Mechanical stretching behavior simulation of SWCNT and SWCNT-Ni”, 2011 International Symposium on Advanced Packaging Materials, APM 2011, p85-90, 2011. (EI, DOI: 10.1109/ISAPM.2011.6105677)