·Paper Publications
Included Journals: EI
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Pre One::
Youkai Chen, Fulong Zhu*, Hengyou Liao, Shao Song, Sheng Liu, “The effect of temperature on compressive mechanical behavior of SWCNT-Ni”, 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, p633-636, 2012. (EI, DOI:10.1109/ICEPT-HDP. 2012. 6474697)
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Next One::
Youkai Chen, Fulong Zhu, Kai Tang, Ying Li, Hengyou Liao, Sheng Liu, “Mechanical behavior investigation of single-walled carbon nanotubes with one vacancy”, 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p579-582, 2013. (EI, DOI: 10.1109/ICEPT. 2013.6756537)