·Paper Publications
Fulong Zhu*, Kai Tang, Ying Li, Ke Duan, Sheng Liu, Yanming Chen, “Heat conduction study across metal/graphene interface by molecular dynamics”, 2014 16th IEEE Electronics Packaging Technology Conference, EPTC2014, p833-836, 2014. ( EI, DOI: 10.1109/EPTC.2014.7028411)
Release time:2018-09-19 Hits:
Included Journals: EI
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Pre One:：
Kai Tang, Fulong Zhu*, Youkai Chen, Ying Li, Hengyou Liao , Xiahui Chen, Sheng Liu, “Effect of Vacancy Defects on Thermal Conductivity of Single-walled Carbon Nanotube”, 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC2013, p817-820, p2013. ( EI, DOI: 10.1109/EPTC. 2013.6745835)
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Next One:：
Simin Wang, Xing Chen, Sheng Liu, Fulong Zhu, Xiaogang Liu, “Estimation of homogenized Young's modulus of silicone/phosphor composite considering random dispersion and size variation of phosphor particles”, Journal of Composite Materials, v50, n14, p1981-1988, 2015. (SCI,EI, DOI:10. 1177/0021998315597992)