·Paper Publications
Ke Duan, Fulong Zhu*, Mingxiang Chen, Ying Li, Yanming Chen, “Warpage Analysis of DBC Substrate based on Non-contact Shadow Moiré Technology”, 2014 The 15th International Conference on Electronic Packaging Technology, ICEPT2014, p1427-1430,2014.( EI, DOI: 10.1109/ICEPT.2014.6922923)
Release time:2018-09-19 Hits:
Included Journals: EI
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Pre One:：
Ke Duan, Fulong Zhu*, Ying Li, Kai Tang, Sheng Liu, Yanming Chen, “Contact Resistance Investigation of Electrical Connector with Different Shrink Range”, in 2014 15th International Conference on Electronic Packaging Technology, ICEPT2014, p1146-1149, 2014. (EI, DOI:10.1109/ICEPT.2014. 6922846)
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Next One:：
Kai Tang, Fulong Zhu*, Ying Li, Ke Duan, Sheng Liu, Yanming Chen, “Effect of Defects on Thermal Conductivity of Graphene”, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, p592-595, 2014. ( EI, DOI: 10.1109/ICEPT.2014.6922725)