·Paper Publications
Liping He, Fulong Zhu*，Ke Duan，Kai Tang, Sheng Liu, “Mechanical response of copper nanowires under torsion”, in 2015 16th International Conference on Electronic Packaging Technology, ICEPT2015, p318-322, 2015. (EI, DOI: 10.1109/ICEPT. 2015. 7236600)
Release time:2018-09-19 Hits:
Included Journals: EI
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Pre One:：
Liping He, Fulong Zhu*, Yuhong Liu, Sheng Liu, “Investigaton of machining mechanism of monocrystalline silicon in nanometric grinding”, AIP Advances, Vol.7, Issue 5, 2017. (SCI, EI, DOI: 10.1063/1.4983216)
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Next One:：
Fulong Zhu*, Hengyou Liao, Kai Tang, Youkai Chen, Sheng Liu, “Molecular dynamics study on the effect of temperature on the tensile properties of single-walled carbon nanotubes with a Ni-coating”, Journal of Nanomaterials, v 2015, 2015(SCI, EI, DOI: 10.1155/2015/767182)