·Paper Publications
Xinxin Lin, Fulong Zhu*, Liping He, Yongjun Pan, Jiaquan Tao, Ke Duan, “Subsurface damage mechanism of wafer thinning process revealed by molecular dynamics simulation”, in 2016 17th International Conference on Electronic Packaging Technology, ICEPT2016, p417-420, 2016 (EI, DOI:10.1109/ICEPT. 2016.7583166)
Release time:2018-09-19 Hits:
Included Journals: EI
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Pre One:：
Xinxin Lin, Fulong Zhu*, Liping He, Yongjun Pan, Jiaquan Tao, Ke Duan, “Subsurface damage mechanism of wafer thinning process revealed by molecular dynamics simulation”, in 2016 17th International Conference on Electronic Packaging Technology, ICEPT2016, p417-420, 2016 (EI, DOI:10.1109/ICEPT. 2016.7583166)
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Next One:：
Liping He, Fulong Zhu*, Yanming Chen, Ke Duan, Xinxin Lin, Yongjun Pan, Jianquan Tao, “Ultrasonic power measurement system based on acousto-optic interaction”, Review of Scientific Instruments, v87, n5, p1-8, 2016.(SCI,EI, DOI: 10.1063/1.4948731)