·Paper Publications
Yongjun Pan, Fulong Zhu*, Xinxin Lin, Jiaquan Tao, Liping He, Han Wang, Sheng Liu, “Comparing the copper and gold wire bonding during thermalsonic wire bonding process”, in 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p 240-243, 2016. (EI, DOI: 10.1109/ICEPT. 2016. 7583127)
Release time:2018-09-19 Hits:
Included Journals: EI
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Pre One:：
Yongjun Pan, Fulong Zhu*, Xinxin Lin, Jiajie Fan and Sheng Liu, “Comparison of Ultrasonic Wire Bonding Process between Gold and Copper by Nonlinear Structure Analysis”, Journal of Adhesion Science and Technology, v32, n18, p 2007-2018, 2018. (SCI.EI, DOI: 10.1080/01694243.2018.1463651)
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Next One:：
Yongjun Pan, Fulong Zhu*, Jiajie Fan, Xinxin Lin, Jiaquan Tao and Sheng Liu, “Thermal-mechanical analysis of high power LED packaging during power cycling test”, 2017 18th International Conference on Electronic Packaging Technology, ICEPT 2017, p1-5, 2017. (EI, DOI: 10.1109/ICEPT.2017.8046394)