·Paper Publications
Fulong Zhu*, Xinxin Lin, Wei Zhang, Jiajie Fan, Sheng Liu, “Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique”, IEEE Access, v6, p33099-33110, 2018. (SCI,EI, DOI:10.1109/ACCESS. 2018. 2842199,*Corresponding author)
Release time:2018-09-19 Hits:
Included Journals: EI、SCI