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An SiC-based half-bridge module with an improved hybrid packaging method for high power density applications. Chen, C.; Chen, Y.; Li, Y.; Huang, Z.; Liu, T.; Kang, Y. IEEE Transactions on Industrial Electronics, 2017
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上一条：On the practical design of a high power density SiC single-phase uninterrupted power supply system. Chen, C.; Chen, Y.; Tan, Y.; Fang, J.; Luo, F.; Kang, Y. IEEE Transactions on Industrial Informatics, 2017
下一条：A review of SiC power module packaging: Layout, material system and integration. Chen, C., Luo, F., Kang, Y. CPSS Transactions on Power Electronics and Applications, 2017