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•宽禁带半导体的封装集成技术
•ED2, ED3, Easy, HV100等商用封装
•DLB封装
•高温封装
•双面封装
•IPM封装
•柔性封装
•封装可靠性
•封装EMI
•高功率密度电力电子变换技术
•高功率密度碳化硅电源
•高功率密度氮化镓电源
- High Efficiency and High Power Density Partial Power Regulation Topology With Wide Input Range. Wu, Z., Wang, Z., Liu, T., Xu, W., Chen, C., Kang, Y. IEEE Transactions on Power Electronics, 2023.
- Analysis of Dead-Time Energy Loss in GaN-based TCM Converters with an Improved GaN HEMT Model. Zhang, Y., Xu, W., Xie, Y., Liu, T., Wu, Z., Chen, C, Kang, Y. IEEE Transactions on Power Electronics, 2023.
- A Stress-Relieved Method based on Bottom Pattern Design Considering Thermal and Mechanical Behavior of DBC Substrate. Chi Zhang; Cai Chen; Yi Zhang; Yiyang Yan; Yong Kang. IEEE Acces, 2023.
- A High Power Density Double-side-end Double Sided Bonding SiC Half-bridge Power Module. Yiyang Yan; Cai Chen; Zongheng Wu;Jiajia Guan;Jianwei Lv;Yong Kang. IEEE Transactions on Transportation Electrification, 2023.
- A Dynamic Current Balancing Method for Paralleled SiC MOSFETs Using Monolithic Si-RC Snubber Based on a Dynamic Current Sharing Model. Lv, J.; Chen, C.; Liu, B.; Yan, Y.; Kang, Y. IEEE Transactions on Power Electronics, 2022.
- A High-Efficiency and High-Power-Density Interleaved Integrated Buck-Boost-LLC Converter and Its Comprehensive Optimal Design Method. Wang, Z.; Wu, Z.; Liu, T.; Chen, C. ; Kang, Y. IEEE Transactions on Power Electronics, 2022.
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