陈材
High frequency conducted EMI investigation on packaging and modulation for a Sic-based high frequency converter. Xie, Y.; Chen, C. ; Huang, Z.; Liu, T.; Kang, Y.; Luo, F. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019
点击次数:
上一条:High frequency conducted EMI investigation on packaging and modulation for a Sic-based high frequency converter. Xie, Y.; Chen, C. ; Huang, Z.; Liu, T.; Kang, Y.; Luo, F. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019
下一条:A High-Performance Embedded SiC Power Module Based on a DBC-Stacked Hybrid Packaging Structure. Huang, Z.; Chen, C.; Xie, Y.; Yan, Y.; Kang, Y.; Luo, F. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019