论文类型：

文章

第一作者：

Fuquan Jina

通讯作者：

Wenlong Li

合写作者：

Sheng Fenga, Yong-an Huanga, Wenlong Li

发表刊物：

Seventh International Conference on Optical and Photonic Engineering

文献类型：

C

卷号：

11205

关键字：

Flexible-electronics, complex surface measuring, 3D matching

发表时间：

2019-10-16

摘要：

Flexible-electronics is gaining increasing popularity in microelectronics such as flexible display, smart skin, epidermal electronics and soft robotics due to cost-effective fabrication and possibility of obtaining multifunctional electronics over large areas. Distinct from conventional microelectronics, flexible curved substrate such as polyimide has been adopted in the flexible-electronics manufacturing process. Hence, how to measure the curved surfaces of the substrates in a precise and fast way has become a key issue. Traditionally, the curved surfaces are usually measured in a coordinate

发布期刊链接：

https://doi.org/10.1117/12.2542246