Laser Transfer, Printing, and Assembly Techniques for Flexible Electronics
发布时间：2020-07-15
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- 论文类型：
- 期刊论文
- 第一作者：
- Jing Bian
- 通讯作者：
- YongAn Huang
- 合写作者：
- Laoboyang Zhou, Xiaodong Wan, Chen Zhu, Biao Yang
- 发表刊物：
- Advanced Electronic Materials
- 学科门类：
- 工学
- 一级学科：
- 机械工程
- 文献类型：
- J
- 卷号：
- 5
- 期号：
- 7
- 页面范围：
- 1800900
- 发表时间：
- 2019-05-13
- 摘要：
- It is challenging to manufacture large-area, ultrathin, flexible/stretchable electronics on an industrial scale. Recent ground-breaking advances in the manufacture of flexible electronics are based on powerful laser processes. Laser irradiation at an internally absorbing interface through a transparent substrate will bring various physical changes and chemical reactions at the interface, accompanied by distinct phenomena. Numerous techniques derived from these phenomena with the unique ability to fabricate materials, structures, and devices on flexible substrates with the advantages of noncont
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