Modeling and Application of Flexible Electronics Packaging
发布时间：2020-04-27
点击次数：
- 所在单位：
- Huazhong University of Science and Technology
- 出版单位：
- Springer Nature & 科学出版社
- 出版地：
- Singapore
- 第一作者：
- 黄永安,尹周平,万晓东
- 著作类别：
- 专著
- 出版社级别：
- 国外（境外）出版社
- 学科门类：
- 工学
- 一级学科：
- 机械工程
- ISBN号：
- 978-981-13-3626-3
- 出版日期：
- 2019-01-01
- 是否译成外文：
- 否
- 简介：
- This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.