·Patents
一种低介微波介质陶瓷材料及其LTCC材料
Release time:2020-09-20 Hits:
Affilication of Author(s): 华中科技大学
Disigner of the Invention: 雷文,杜康,吕文中,王晓川,汪小红,范桂芬,付明
Type of Patent: Invent
Authorization number: ZL201910927298.3
Authorization Date: 2020-09-08
Affilication of Author(s): 华中科技大学
Disigner of the Invention: 雷文,杜康,吕文中,王晓川,汪小红,范桂芬,付明
Type of Patent: Invent
Authorization number: ZL201910927298.3
Authorization Date: 2020-09-08