·Paper Publications
Indexed by: Journal paper
Co-author: R Chen, S Li, J Liu, Y Li, F Ma, J Liang, X Chen, Z Miao, J Han, T Wang, Q Li
Journal: Electrochimica Acta
Included Journals: SCI
Volume: 282
Page Number: 973-980
Date of Publication: 2018-08-01
Links to published journals: https://www.sciencedirect.com/science/article/pii/S0013468618315275
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Pre One:：
016 Wen-Jie Wu, Tao Zhu, Jin-Quan Liu, Ji Fan and Liang-Cheng Tu*, Polyimide-Damage-Free, CMOS-Compatible Removal of Polymer Residues from Deep Reactive Ion Etching Passivation. Journal of Electronic Materials, 44 (2015) 991-998 (8pages)
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Next One:：
017 Ji Fan, Wen-Ting Zhang, Jin-Quan Liu, Wen-Jie Wu, Tao Zhu and Liang-Cheng Tu*, Fabrication of high aspect ratio structure and its releasing for silicon on insulator MEMS/MOEMS device application. J. Micro/Nanolith. MEMS MOEMS 14(2015) 024502 (6pages)