Liangcheng Tu
·Paper Publications
01 Xiao-Li Wei, Jin-Quan Liu, Hua-Feng Liu, Wen-Jie Wu, Ji Fan and Liang-Cheng Tu*. Electroplating of 3D Sn-rich solder for MEMS packaging applications. J. Micromech. Microeng. 29 (2019) 045008. (7pages)
Release time:2019-03-16 Hits:
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[6] Cheng Ling, Huang Kai, Cui Hairong, Wang Xiu, Zhang Hongxing, Zeng Lingshuai, Zhang Xiu, Wang Bingmao, Zhou Yikai, Jing Tao*, Coiled molecularly imprinted polymer layer open-tubular capillary tube for detection of parabens in personal care and cosmetic products, Science of The Total Environment, 2020, 706, 135961.
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[8] Wang Xiu, Huang Kai, Cui Hairong, Zhang Hongxing, Zeng Lingshuai, Zhou Yikai, Jing Tao*, Label-free determination of thyroglobulin using template-probe double imprinted composites, Sensors and Actuators B: Chemical, 2020, 313, 128028.