Liangcheng Tu
·Paper Publications
02 Xiao-Xiao Song, Qiu Wang, Hua-Feng Liu, Guang-Bin Dou, Hao Li, Wen-Jie Wu, Fang-Jing Hu*, Ji Fan, Jin-Quan Liu and Liang-Cheng Tu. A method for alleviating the effect of pinhole defects in inter-metal dielectric films. J. Micromech. Microeng. 29 (2019) 015012. (6pages)
Release time:2019-03-16 Hits:
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03 Lin Zhu, Qi Liu, Hui-Hui Zhao, Qi-Long Gong, Shan-Qing Yang, Pengshun Luo, Cheng-Gang Shao, Qing-Lan Wang, Liang-Cheng Tu, and Jun Luo. Test of the Equivalence Principle with Chiral Masses Using a Rotating Torsion Pendulum. Phys. Rev. Lett. 121 (2018)261101
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01 Xiao-Li Wei, Jin-Quan Liu, Hua-Feng Liu, Wen-Jie Wu, Ji Fan and Liang-Cheng Tu*. Electroplating of 3D Sn-rich solder for MEMS packaging applications. J. Micromech. Microeng. 29 (2019) 045008. (7pages)