Chumming Wang
·Patents
一种面向厚板的窄间隙多道激光焊接方法
Release time:2025-05-16 Hits:
Patent Applicant: 华中科技大学
Disigner of the Invention: 王春明;李若杨;邵新宇;王天骄;胡席远;王军
Type of Patent: Invent
Application Number: CN201210549013.5
Application Date: 2012-12-15
Publication Date: 2015-04-15