Chumming Wang
·Patents
一种激光复合焊接头装置
Release time:2025-05-16 Hits:
Patent Applicant: 东莞华中科技大学制造工程研究院;华中科技大学
Disigner of the Invention: 李斌;段正澄;黄禹;蔡立兵;龚时华;彭芳瑜;王春明
Type of Patent: Utility models
Application Number: CN200720055264.2
Application Date: 2007-08-07
Publication Date: 2008-06-18