Chumming Wang
·Patents
激光-高频感应复合焊接装置及其方法
Release time:2025-05-16 Hits:
Patent Applicant: 华中科技大学
Disigner of the Invention: 王春明;胡席远;刘建华;胡伦骥;陈俐
Type of Patent: Invent
Application Number: CN200310111658.1
Application Date: 2003-12-26
Publication Date: 2006-08-02