Chumming Wang
·Patents
一种金属基复合材料成形中的超高速增强相颗粒均布装置
Release time:2025-05-16 Hits:
Patent Applicant: 华中科技大学
Disigner of the Invention: 蓟思益;米高阳;王春明;马修泉;胡溢洋
Type of Patent: Invent
Application Number: CN202110624479.6
Application Date: 2021-06-04
Publication Date: 2023-05-23