Chumming Wang
·Patents
同步送粉穿光焊接方法及系统
Release time:2025-05-16 Hits:
Patent Applicant: 华中科技大学
Disigner of the Invention: 米高阳;张铭洋;王春明;熊凌达;张熊;胡溢洋
Type of Patent: Invent
Application Number: CN202110458952.8
Application Date: 2021-04-27
Publication Date: 2021-07-23