Chumming Wang
·Patents
抑制厚板激光穿透焊接下塌缺陷的方法及气体加载装置
Release time:2025-05-16 Hits:
Patent Applicant: 华中科技大学
Disigner of the Invention: 张熊;王春明;米高阳;蒋平;邵新宇
Type of Patent: Invent
Application Number: CN202011095218.1
Application Date: 2020-10-14
Publication Date: 2021-01-12